In the modern microelectronics industry, copper wire is commonly used due to its high conductivity and low cost compared to alternatives such as gold. The joining of copper wire to aluminum in wire bonding results in galvanic corrosion between the two dissimilar metals, which hurts the longevity and reliability of such bonds. The primary goal of our studies is to find ways to prevent copper aluminum galvanic corrosion, improving the reliability of microelectronics while maintaining low cost. Our hypothesis is that phosphonic acid can form SAMs on an oxidized aluminum surface that are effective and durable.