Miniaturization in microelectronics continues to create problems with the wafer fabrication process. With transistor sizes reaching < 7 nanometers, it is critical to control the materials chemistry at molecular-level in order to achieve this daunting wafer fabrication goals. Novel chemical bonding transformation analysis metrology using Infrared Spectroscopy, invented by Dr. Chyan, can provide much needed molecular-level guidance to successfully fabricate nanostructure on silicon wafer. The work reported here refers to the development of optical modules used for Transmission Infrared Spectroscopy (TIR) which is a component of Dr. Chyan’s invention. Iterations of the device through the development process were designed with Autodesk Inventor 2019 CAD software and 3D printed using a PolyPrinter 508. The accessories were then tested using a Bruker Vertex 70 Infrared Spectrometer. Testing revealed that the measuring capabilities of the new device greatly exceeds those of commercially available accessories while improving on the cost of production and user experience of previous prototypes.