Kaushik Akula

First Name: 
Kaushik
Last Name: 
Akula
Mentor: 
Dr. Oliver Chyan
Abstract: 
One of the largest problems with microelectronic devices is reliability. A significant factor contributing to electronic failure is electrochemical migration caused by the oxidation of exposed copper surfaces in harsh environmental terrain. Using various organic compound coatings on these devices, the lifetime of microelectronics is protected and prolonged. To analyze the effectiveness of coatings, accelerated electrochemical testing experiments are recorded through a microscope camera to emulate oxidation over years in hours. By improving the software used to analyze these recorded testing videos, the timing, compounds, and procedure used in coating these devices is resultantly optimized for reliable industry usage.
Poster: 
Analyzing Interfacial Copper Migration on Microelectronic Devices with Organic Chemical Coatings
Year: 
2021