In microelectronics and integrated circuits (ICs), copper has become the preferred wire-bonding material due to its exceptional conductivity and inexpensive cost. Likewise, aluminum is one of the most widely used materials for bonding pads because of its superior strength-to-weight ratio and favorable protective properties. However, the electrical contact between the dissimilar metals results in galvanic, also known as bimetallic, corrosion. One method to combat this is the use of self-assembled monolayers (SAMs). They provide excellent insulating dielectric layers despite their thinness and can be easily fabricated.